Exploring of simulating passing through feeling on the wrist: Using thermal feedback

Wei Peng, Roshan Lalintha Peiris, Kouta Minamizawa

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

Wearable devices combining with VR/AR technology become a research hotspot these years. In some research, tactile displays are put on the skin and synchronized with VR/AR environment. Researchers try to use these display to simulate varied embodied feeling to enhance the immersion in the VR/AR environment. In the field of game entertainment, based on the scenario, sometimes the feeling of passing through the body need to be presented to the user. However this is physically impossible. Thus we make a exploration attempting to simulate this feeling by thermal feedback. Here we use two thermal modules bonding on the two side of the wrist (inside and outside). When we actuate two modules sequentially, user would perceive the stimuli and interpret this into a feeling of passing though. In the paper, we will introduce the interface and describe the experiment to determine the principle for thermo-tactile illusion of passing through.

元の言語English
ホスト出版物のタイトルUIST 2017 Adjunct - Adjunct Publication of the 30th Annual ACM Symposium on User Interface Software and Technology
出版者Association for Computing Machinery, Inc
ページ187-188
ページ数2
ISBN(電子版)9781450354196
DOI
出版物ステータスPublished - 2017 10 20
イベント30th Annual ACM Symposium on User Interface Software and Technology, UIST 2017 - Quebec City, Canada
継続期間: 2017 10 222017 10 25

Other

Other30th Annual ACM Symposium on User Interface Software and Technology, UIST 2017
Canada
Quebec City
期間17/10/2217/10/25

    フィンガープリント

ASJC Scopus subject areas

  • Software
  • Human-Computer Interaction
  • Computer Graphics and Computer-Aided Design

これを引用

Peng, W., Peiris, R. L., & Minamizawa, K. (2017). Exploring of simulating passing through feeling on the wrist: Using thermal feedback. : UIST 2017 Adjunct - Adjunct Publication of the 30th Annual ACM Symposium on User Interface Software and Technology (pp. 187-188). Association for Computing Machinery, Inc. https://doi.org/10.1145/3131785.3131819