Fatigue crack growth in lead-free solder joints

Masaki Omiya, Kikuo Kishimoto, Masazumi Amagai

研究成果: Conference contribution

抜粋

This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service periods. Due to its brittle nature and lattice mismatch, the solder cracks tend to be generated near the compounds and these cracks affects the mechanical integrity of solder joints. Therefore, it is important to study the effect of intermetallic compounds development on the mechanical properties of the solder joints. In this paper, we focused on the low cycle fatigue of solder joints and investigate the effects of intermetallic compounds development on the fatigue life and the fatigue crack growth behavior of the solder joints.

元の言語English
ホスト出版物のタイトルProceedings - EMAP 2005
ホスト出版物のサブタイトル2005 International Symposium on Electronics Materials and Packaging
ページ232-237
ページ数6
DOI
出版物ステータスPublished - 2005 12 1
外部発表Yes
イベントEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
継続期間: 2005 12 112005 12 14

出版物シリーズ

名前Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
Japan
Tokyo
期間05/12/1105/12/14

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Omiya, M., Kishimoto, K., & Amagai, M. (2005). Fatigue crack growth in lead-free solder joints. : Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging (pp. 232-237). [1598267] (Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging; 巻数 2005). https://doi.org/10.1109/EMAP.2005.1598267