FBG strain sensor with temperature compensation mechanism

H. Hayano, A. Mita

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

An FBG-based strain sensor equipped with a mechanical te mperature compensation system is proposed. Direct bonding of an FBG element, that is the simplest method to measure strains, may cause broadening of the reflected optical spectrum due to fluctuation of strain distribution of the material under the FBG element. The proposed sensor avoids this difficulty by introducing a mechanism to induce uniform strain distribution to the FBG element. In addition, a simple mechanical system that can cancel the effect of temperature on the strain measurement does eliminate the addition of another FBG sensor for temperature compensation. Extensive tests have been conducted using prototype sensors. The results showed their excellent performance.

本文言語English
ホスト出版物のタイトルStructural Health Monitoring and Intelligent Infrastructure - Proceedings of the 1st International Conference on Structural Health Monitoring and Intelligent Infrastructure
ページ1259-1266
ページ数8
出版ステータスPublished - 2003 12 1
イベント1st International Conference on Structural Health Monitoring and Intelligent Infrastructure, SHMII-1'2003 - Tokyo, Japan
継続期間: 2003 11 132003 11 15

出版物シリーズ

名前Structural Health Monitoring and Intelligent Infrastructure - Proceedings of the 1st International Conference on Structural Health Monitoring and Intelligent Infrastructure
2

Other

Other1st International Conference on Structural Health Monitoring and Intelligent Infrastructure, SHMII-1'2003
国/地域Japan
CityTokyo
Period03/11/1303/11/15

ASJC Scopus subject areas

  • 建築および建設
  • 建築

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