Frequency model of haptic information in rubbing motion

Takami Miyagi, Seiichiro Katsura

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

This paper proposes the new frequency model of haptic information focused on the vibration component in friction force. Recently, haptic information is attracting attention from many areas as the tertiary media following the audio and visual information. However, due to the characters of the bidirectionality and self-reference, treatment is difficult as compared to the other sensory information. Unified representation method still not been established. Therefore, this paper focuses on the vibration components of friction force in rubbing motion against environmental surface in particular. The friction force in rubbing motion is measured for broadband by using the 2-DOF system constructed by two linear motors. For the quantitative evaluation of the frequency domain, cepstral analysis which is the method for voice-print analysis is applied. The effectiveness of the proposed model is shown by performing experiments and analysis with three different environmental surfaces. Moreover, this paper presents the identification for each parameters of the model from the acquired data, and construct a accurate model of the friction force for each environment.

元の言語English
ホスト出版物のタイトルProceedings, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society
ページ4132-4137
ページ数6
DOI
出版物ステータスPublished - 2013 12 1
イベント39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013 - Vienna, Austria
継続期間: 2013 11 102013 11 14

出版物シリーズ

名前IECON Proceedings (Industrial Electronics Conference)

Other

Other39th Annual Conference of the IEEE Industrial Electronics Society, IECON 2013
Austria
Vienna
期間13/11/1013/11/14

    フィンガープリント

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Miyagi, T., & Katsura, S. (2013). Frequency model of haptic information in rubbing motion. : Proceedings, IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society (pp. 4132-4137). [6699798] (IECON Proceedings (Industrial Electronics Conference)). https://doi.org/10.1109/IECON.2013.6699798