Generation of micro/nano hybrid surface structures on copper by femtosecond pulsed laser irradiation

Ayumi Nakajima, Masaki Omiya, Jiwang Yan

研究成果: Article査読

1 被引用数 (Scopus)

抄録

The delamination of copper lead frames from epoxy molding compounds (EMC) is a severe problem for microelectronic devices, as it leads to reduced heat dissipation or circuit breakage. The micro/nanoscale surface structuring of copper is a promising method to improve the copper–EMC interfacial adhesion. In this study, the generation of micro/nano hybrid structures on copper surfaces through femtosecond pulsed laser irradiation is proposed to improve interfacial adhesion. The micro/nano hybrid structures were realized by generating nanoscale laser-induced periodic surface structures (LIPSS) on microscale parallel grooves. Several types of hybrid surface structures were generated by changing the laser polarization direction, fluence, and scanning speed. At a specific aspect ratio of microgrooves, a latticed structure was generated on the sides of microgrooves by combining LIPSS formation and direct laser interference patterning. This study provides an efficient method for the micro/nanoscale hybrid surface structure formation for interfacial adhesion improvement between copper and EMC.

本文言語English
ページ(範囲)274-282
ページ数9
ジャーナルNanomanufacturing and Metrology
5
3
DOI
出版ステータスPublished - 2022 9月

ASJC Scopus subject areas

  • 材料科学(その他)
  • 機械工学
  • 産業および生産工学

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