Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration

Akira Yamauchi, Yoshie Morimoto, Tadayuki Enomoto, Kyuta Suzuki, Hikaru Masuda, Takaaki Ishigure

研究成果: Conference contribution

6 引用 (Scopus)

抄録

We present polymer optical waveguides with graded index (GI) circular core that have unique structures on their ends to enable very low-loss 90-degree vertical optical path conversion. In general, the signal light from the VCSELs mounted on optical printed circuit boards (OPCBs) needs to be perpendicularly bent in order to couple to the waveguides integrated on board and similarly from the waveguide to the photodetectors. Therefore, optical path conversion structures between horizontal and vertical directions are required on the ends of waveguides. In the case of multimode polymer optical waveguides with step-index (SI) core, 45-degree mirrors at the waveguide ends should be a well-known technique when they are integrated on boards. However, a couple of dB of optical loss at lowest has generally been observed at the mirrors, which is very critical for the limited link power budget of polymer waveguide links. In this paper, we demonstrate that GI-cores in polymer waveguides enable 3-dB loss advantage over the SI-core waveguides in the optical path conversion.

元の言語English
ホスト出版物のタイトルProceedings - ECTC 2016: 66th Electronic Components and Technology Conference
出版者Institute of Electrical and Electronics Engineers Inc.
ページ490-496
ページ数7
2016-August
ISBN(電子版)9781509012039
DOI
出版物ステータスPublished - 2016 8 16
イベント66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
継続期間: 2016 5 312016 6 3

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
United States
Las Vegas
期間16/5/3116/6/3

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Optical waveguides
Polymers
Waveguides
Printed circuit boards
Telecommunication links
Optical losses
Surface emitting lasers
Photodetectors

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

これを引用

Yamauchi, A., Morimoto, Y., Enomoto, T., Suzuki, K., Masuda, H., & Ishigure, T. (2016). Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (巻 2016-August, pp. 490-496). [7545476] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.306

Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration. / Yamauchi, Akira; Morimoto, Yoshie; Enomoto, Tadayuki; Suzuki, Kyuta; Masuda, Hikaru; Ishigure, Takaaki.

Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. p. 490-496 7545476.

研究成果: Conference contribution

Yamauchi, A, Morimoto, Y, Enomoto, T, Suzuki, K, Masuda, H & Ishigure, T 2016, Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻. 2016-August, 7545476, Institute of Electrical and Electronics Engineers Inc., pp. 490-496, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, Las Vegas, United States, 16/5/31. https://doi.org/10.1109/ECTC.2016.306
Yamauchi A, Morimoto Y, Enomoto T, Suzuki K, Masuda H, Ishigure T. Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration. : Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August. Institute of Electrical and Electronics Engineers Inc. 2016. p. 490-496. 7545476 https://doi.org/10.1109/ECTC.2016.306
Yamauchi, Akira ; Morimoto, Yoshie ; Enomoto, Tadayuki ; Suzuki, Kyuta ; Masuda, Hikaru ; Ishigure, Takaaki. / Graded-Index Multimode Polymer Optical Waveguide Enabling Low Loss and High Density 3D On-Board Integration. Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. 巻 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. pp. 490-496
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