TY - GEN
T1 - High efficiency precision surface grinding of fused silica
AU - Yao, Peng
AU - Gong, Yadong
AU - Yuan, Suoxian
AU - Yoshihara, Nobuhito
AU - Yan, Jiwang
AU - Kuriyagawa, Tsunemoto
N1 - Copyright:
Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012
Y1 - 2012
N2 - High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.
AB - High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.
KW - Creep feed grinding
KW - Fused silica
KW - Undeformed chip thickness
KW - Wheel wear
UR - http://www.scopus.com/inward/record.url?scp=84857979488&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84857979488&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.418-420.1132
DO - 10.4028/www.scientific.net/AMR.418-420.1132
M3 - Conference contribution
AN - SCOPUS:84857979488
SN - 9783037853269
T3 - Advanced Materials Research
SP - 1132
EP - 1136
BT - Materials Processing Technology
T2 - 2nd International Conference on Advances in Materials and Manufacturing, ICAMMP 2011
Y2 - 16 December 2011 through 18 December 2011
ER -