Improvement of grinding fluid application in creep feed grinding. Removal of loading chips on grinding wheel surface by means of ultrasonic cleaning.

Y. Tsunasawa, H. Aoyama, T. Aoyama, I. Inasaki

研究成果: Article査読

1 被引用数 (Scopus)

抄録

Thermal damage of the ground surface is one of the most serious problems in creep feed grinding. Loading of chips on the grinding wheel surface causes an increase of heat generation in the grinding process and disturbs efficient application of grinding fluid because of the decrease of chip pocket volume. In this study an ultrasonic cleaning method was applied to remove the loading chips from the wheel during the grinding process. The effect of this new method on the reduction of grinding power consumption as well as on the reduction of grinding temperature was confirmed through the experiments. (from English abstract)

本文言語English
ページ(範囲)1239-1243
ページ数5
ジャーナルJ. JAPAN SOC. PRECIS. ENGNG.
50
8 , Aug. 1984
DOI
出版ステータスPublished - 1984
外部発表はい

ASJC Scopus subject areas

  • 機械工学

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