Improvement of ground surface roughness of optical materials by means of cutting edge truncation of metal-bonded diamond grinding wheel

Xijun Kang, Jim'ichi Tamaki, Akihiko Kubo, Jiwang Yan, Toshirou Iyama

研究成果: Paper査読

抄録

Glass quartz, ciystal quartz and single ciystal silicon are plunge ground with different mesh sizes of metal-bonded diamond grinding wheels, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the difference in ground surface morphologies between them are investigated. It is found that ductile-mode grinding of quartz is likely to be realized by the cutting edge truncation and a SD600 grinding wheel brings about a surface morphology better than SD270 grinding wheel, even if both the grinding wheels are truncated.

本文言語English
ページ193-198
ページ数6
出版ステータスPublished - 2005 12 1
外部発表はい
イベント3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005 - Nagoya, Japan
継続期間: 2005 10 192005 10 22

Other

Other3rd International Conference on Leading Edge Manufacturing in 21st Century, LEM 2005
CountryJapan
CityNagoya
Period05/10/1905/10/22

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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