Improving energy efficiency in data centers by controlling task distribution and cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The rapid growth in cloud computing, the Internet of Things (IoT), and data processing via Machine Learning (ML), have greatly increased our need for computing resources. Given this rapid growth, it is expected that data centers will consume more and more of our global energy supply. Improving their energy efficiency is therefore crucial. One of the biggest sources of energy consumption is the energy required to cool the data centers, and ensure that the servers stay within their intended operating temperature range. Indeed, about 40% of a data center’s total power consumption is for air conditioning[1]. Here, we study how the server air inlet and outlet, as well as the CPU, temperatures depend upon server loads typical of real Internet Protocol (IP) traces. The trace data used here are from Google clusters and include the times, job and task ID, as well as the number and usage of CPU cores. The resulting IT loads are distributed using standard load-balancing methods such as Round Robin (RR) and the CPU utilization method. Experiments are conducted in the Data Center Laboratory (DCL) at the Georgia Institute of Technology to monitor the server outlet air temperature, as well as real-time CPU temperatures for servers at different heights within the rack. Server temperatures were measured by on-line temperature monitoring with Xbee, Raspberry PI, Arduino, and hot-wire anemometers. Given that the temperature response varies with server position, in part due to spatial variations in the cooling airflow over the rack inlet and the server fan speeds, a new load-balancing approach that accounts for spatially varying temperature response within a rack is tested and validated in this paper.

本文言語English
ホスト出版物のタイトルASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
出版社American Society of Mechanical Engineers (ASME)
ISBN(電子版)9780791851920
DOI
出版ステータスPublished - 2018
イベントASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018 - San Francisco, United States
継続期間: 2018 8 272018 8 30

出版物シリーズ

名前ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018

Other

OtherASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018
国/地域United States
CitySan Francisco
Period18/8/2718/8/30

ASJC Scopus subject areas

  • 電子工学および電気工学
  • ハードウェアとアーキテクチャ

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