Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages

Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura

研究成果: Conference contribution

抜粋

Capability of detecting local interface strength variation with 10 μm scale resolution was investigated in reference to the interface between vapor-deposited gold (Au) and SiO2 with a practically homogeneous strength. Uncertainties in the evaluation procedure were thoroughly examined, which was to be excluded from the apparent scatter of evaluation results. The intrinsic scatter of strength in a damascene Cu/SiN cap interface was successfully specified to be at least 2.45 J/m2.

元の言語English
ホスト出版物のタイトルASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
DOI
出版物ステータスPublished - 2011 12 1
イベントASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
継続期間: 2011 7 62011 7 8

出版物シリーズ

名前ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
1

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
United States
Portland, OR
期間11/7/611/7/8

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

これを引用

Shishido, N., Matsumoto, S., Chen, C., Sato, H., Omiya, M., Kamiya, S., Nishida, M., Nokuo, T., Nagasawa, T., Suzuki, T., & Nakamura, T. (2011). Interface toughness evaluation with specimens fabricated by focused ion beam for micro scale devices and packages. : ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; 巻数 1). https://doi.org/10.1115/IPACK2011-52270