Laser micro-Raman spectroscopy of single-point diamond machined silicon substrates

研究成果: Article査読

73 被引用数 (Scopus)

抄録

Due to its hard and brittle nature, silicon is currently finished by lapping and chemomechanical polishing (CMP). However, silicon can be plastically deformed in a ductile manner in ultraprecision machining at an extremely smooth surfaces. Using the ductile machining technology, the productivity of aspherical, diffractive optical components, and large-diameter substrates for recent microelectronic mechanical system (MEMS) applications can be significantly improved.

本文言語English
ページ(範囲)2094-2101
ページ数8
ジャーナルJournal of Applied Physics
95
4
DOI
出版ステータスPublished - 2004 2月 15
外部発表はい

ASJC Scopus subject areas

  • 物理学および天文学(全般)

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