Liquid encapsulation by Bonding-in-Liquid Technique

Yoshiyuki Okayama, Keijiro Nakahara, Takeshi Ninomiya, Yasuaki Matsumoto, Norihisa Miki

研究成果: Conference contribution

抄録

We propose and demonstrate Bonding-in-Liquid Technique (BiLT) for encapsulation of liquid in MEMS devices. Liquid encapsulation enables innovative MEMS devices with various functions. Interfusion of air bubbles, heterogeneity of the liquid quantity, and leakage of the encapsulated liquid must be averted not to deteriorate device performances. In BiLT, two structural layers are passively aligned and brought into contact in solution, where the encapsulation cavities are uniformly filled up with the liquid without air bubbles. A UV-curable resin is used as an adhesive that does not require heat or vacuum environment but UV to bond the two layers. We successfully achieved encapsulation of DI water and glycerin in silicon structural layers. Since conventional aligners are not applicable to BiLT, we experimentally evaluated the accuracy of the passive alignment process in solution that makes use of matching concave and convex structures.

本文言語English
ホスト出版物のタイトルMicroelectromechanical Systems - Materials and Devices III
ページ197-202
ページ数6
出版ステータスPublished - 2010 8 30
イベント2009 MRS Fall Meeting - Boston, MA, United States
継続期間: 2009 11 302009 12 4

出版物シリーズ

名前Materials Research Society Symposium Proceedings
1222
ISSN(印刷版)0272-9172

Other

Other2009 MRS Fall Meeting
国/地域United States
CityBoston, MA
Period09/11/3009/12/4

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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