Liquid encapsulation by Bonding-in-Liquid Technique

Engineering & Materials Science

• Encapsulation 100%
• Liquids 58%
• MEMS 20%
• Glycerol 13%
• Leakage (fluid) 12%
• Air 12%
• Adhesives 9%
• Resins 9%
• Vacuum 9%
• Silicon 8%
• Water 5%
• Hot Temperature 5%

Chemical Compounds

• Encapsulation 76%
• Liquid 47%
• Bubble 37%
• Heterogeneity 16%
• Glycerol 15%
• Vacuum 14%
• Heat 13%
• Environment 10%

Physics & Astronomy

• liquids 46%
• microelectromechanical systems 24%
• bubbles 19%
• liquid air 16%
• resins 12%
• adhesives 12%
• leakage 10%
• alignment 9%
• heat 8%
• vacuum 7%
• cavities 7%
• air 7%
• water 7%
• silicon 6%
• performance 5%