TY - GEN
T1 - Macroscopic and microscopic interface adhesion strength of copper damascene interconnects
AU - Shishido, N.
AU - Kamiya, S.
AU - Chen, C.
AU - Sato, H.
AU - Koiwa, K.
AU - Omiya, M.
AU - Nishida, M.
AU - Suzuki, T.
AU - Nakamura, T.
AU - Nokuo, T.
AU - Suzuki, T.
PY - 2013
Y1 - 2013
N2 - Macroscopic and microscopic adhesion strength of damascene interconnects was investigated by evaluating local strength through delaminating different scales of adhesion area under SEM observation. Macroscopic strength obtained by the areas larger than the copper grain was almost constant after considering the macroscopic plastic deformation. However, microscopic strength obtained by the areas smaller than the copper grain spread around the macroscopic strength and was highly sensitive to the copper grain structure, especially the grain boundary.
AB - Macroscopic and microscopic adhesion strength of damascene interconnects was investigated by evaluating local strength through delaminating different scales of adhesion area under SEM observation. Macroscopic strength obtained by the areas larger than the copper grain was almost constant after considering the macroscopic plastic deformation. However, microscopic strength obtained by the areas smaller than the copper grain spread around the macroscopic strength and was highly sensitive to the copper grain structure, especially the grain boundary.
UR - http://www.scopus.com/inward/record.url?scp=84886668511&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84886668511&partnerID=8YFLogxK
U2 - 10.1109/IITC.2013.6615564
DO - 10.1109/IITC.2013.6615564
M3 - Conference contribution
AN - SCOPUS:84886668511
SN - 9781479904396
T3 - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
BT - Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
T2 - 2013 16th IEEE International Interconnect Technology Conference, IITC 2013
Y2 - 13 June 2013 through 15 June 2013
ER -