Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

N. Shishido, S. Kamiya, C. Chen, H. Sato, K. Koiwa, M. Omiya, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Suzuki

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

Macroscopic and microscopic adhesion strength of damascene interconnects was investigated by evaluating local strength through delaminating different scales of adhesion area under SEM observation. Macroscopic strength obtained by the areas larger than the copper grain was almost constant after considering the macroscopic plastic deformation. However, microscopic strength obtained by the areas smaller than the copper grain spread around the macroscopic strength and was highly sensitive to the copper grain structure, especially the grain boundary.

本文言語English
ホスト出版物のタイトルProceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
DOI
出版ステータスPublished - 2013
イベント2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan
継続期間: 2013 6月 132013 6月 15

出版物シリーズ

名前Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

Other

Other2013 16th IEEE International Interconnect Technology Conference, IITC 2013
国/地域Japan
CityKyoto
Period13/6/1313/6/15

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 制御およびシステム工学

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