抄録
Micro-grooves were machined onto a single-crystal diamond surface by laser irradiation with a nanosecond pulse, and the resulting damage was investigated. The causes of four different forms of damage have been identified and examined; cracking, ripple formation, groove shape deformation and debris deposition. Cracking is caused by a rapid temperature change; ripples by interference of the laser reflected from the groove walls; groove shape deformation by enhanced absorption of the laser-induced plasma; deposited ablation debris by two different ablation regimes. Cracking and shape deformation is reduced at the center of the groove, which is very smooth and ripple-free for line irradiations using a single pass. These results provide useful information for reducing the laser-induced damage in diamond and creating damage-free micro-grooved diamond cutting tools.
本文言語 | English |
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ページ(範囲) | 299-311 |
ページ数 | 13 |
ジャーナル | Journal of Materials Processing Technology |
巻 | 243 |
DOI | |
出版ステータス | Published - 2017 5月 1 |
ASJC Scopus subject areas
- セラミックおよび複合材料
- モデリングとシミュレーション
- コンピュータ サイエンスの応用
- 金属および合金
- 産業および生産工学