Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Nobuyuki Shishido, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

研究成果: Conference contribution

6 引用 (Scopus)

抄録

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

元の言語English
ホスト出版物のタイトルAIP Conference Proceedings
ページ33-38
ページ数6
1300
DOI
出版物ステータスPublished - 2010
イベント11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
継続期間: 2010 4 122010 4 14

Other

Other11th International Workshop on Stress-Induced Phenomena in Metallization
Germany
Bad Schandau
期間10/4/1210/4/14

Fingerprint

large scale integration
evaluation
adhesion
caps
electronics
energy

ASJC Scopus subject areas

  • Physics and Astronomy(all)

これを引用

Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., ... Nagasawa, T. (2010). Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. : AIP Conference Proceedings (巻 1300, pp. 33-38) https://doi.org/10.1063/1.3527134

Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. / Kamiya, Shoji; Sato, Hisashi; Nishida, Masahiro; Chen, Chuantong; Shishido, Nobuyuki; Omiya, Masaki; Suzuki, Takashi; Nakamura, Tomoji; Nokuo, Takeshi; Nagasawa, Tadahiro.

AIP Conference Proceedings. 巻 1300 2010. p. 33-38.

研究成果: Conference contribution

Kamiya, S, Sato, H, Nishida, M, Chen, C, Shishido, N, Omiya, M, Suzuki, T, Nakamura, T, Nokuo, T & Nagasawa, T 2010, Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. : AIP Conference Proceedings. 巻. 1300, pp. 33-38, 11th International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 10/4/12. https://doi.org/10.1063/1.3527134
Kamiya S, Sato H, Nishida M, Chen C, Shishido N, Omiya M その他. Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. : AIP Conference Proceedings. 巻 1300. 2010. p. 33-38 https://doi.org/10.1063/1.3527134
Kamiya, Shoji ; Sato, Hisashi ; Nishida, Masahiro ; Chen, Chuantong ; Shishido, Nobuyuki ; Omiya, Masaki ; Suzuki, Takashi ; Nakamura, Tomoji ; Nokuo, Takeshi ; Nagasawa, Tadahiro. / Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. AIP Conference Proceedings. 巻 1300 2010. pp. 33-38
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AU - Suzuki, Takashi

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