Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects

Shoji Kamiya, Hisashi Sato, Masahiro Nishida, Chuantong Chen, Nobuyuki Shishido, Masaki Omiya, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa

研究成果: Conference contribution

6 引用 (Scopus)

抜粋

Reliability of electronic devices has been an issue of serious importance. One of the potential factors to spoil the reliability is possible local drops of strength on the interface of multilayered structure. A new technique for the evaluation of local interface adhesion energy was applied to the interface between Cu and cap layer in a Cu damascene interconnect structure, in order to elucidate variation in adhesion strength as a function of measurement location.

元の言語English
ホスト出版物のタイトルStress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization
ページ33-38
ページ数6
DOI
出版物ステータスPublished - 2010 12 1
イベント11th International Workshop on Stress-Induced Phenomena in Metallization - Bad Schandau, Germany
継続期間: 2010 4 122010 4 14

出版物シリーズ

名前AIP Conference Proceedings
1300
ISSN(印刷物)0094-243X
ISSN(電子版)1551-7616

Other

Other11th International Workshop on Stress-Induced Phenomena in Metallization
Germany
Bad Schandau
期間10/4/1210/4/14

ASJC Scopus subject areas

  • Physics and Astronomy(all)

フィンガープリント Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Kamiya, S., Sato, H., Nishida, M., Chen, C., Shishido, N., Omiya, M., Suzuki, T., Nakamura, T., Nokuo, T., & Nagasawa, T. (2010). Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects. : Stress-Induced Phenomena in Metallization - Eleventh International Workshop on Stress-Induced Phenomena in Metallization (pp. 33-38). (AIP Conference Proceedings; 巻数 1300). https://doi.org/10.1063/1.3527134