TY - GEN
T1 - Micro suction cup array for wet/dry adhesion
AU - Thanh-Vinh, N.
AU - Takahashi, H.
AU - Kan, T.
AU - Noda, K.
AU - Matsumoto, K.
AU - Shimoyama, I.
PY - 2011/4/13
Y1 - 2011/4/13
N2 - We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.
AB - We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.
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U2 - 10.1109/MEMSYS.2011.5734417
DO - 10.1109/MEMSYS.2011.5734417
M3 - Conference contribution
AN - SCOPUS:79953770946
SN - 9781424496327
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 284
EP - 287
BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Y2 - 23 January 2011 through 27 January 2011
ER -