Micro suction cup array for wet/dry adhesion

N. Thanh-Vinh, H. Takahashi, T. Kan, K. Noda, K. Matsumoto, I. Shimoyama

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.

本文言語English
ホスト出版物のタイトル2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
ページ284-287
ページ数4
DOI
出版ステータスPublished - 2011 4 13
外部発表はい
イベント24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
継続期間: 2011 1 232011 1 27

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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