Microstructures and grain boundaries of (Ti,Al)N films

T. Suzuki, D. Huang, Y. Ikuhara

研究成果: Article査読

55 被引用数 (Scopus)

抄録

Titanium and titanium-aluminum targets 100 φ in diameter were arc-discharged at ~500 °C under nitrogen plasma conditions, and thin films were synthesized on cemented carbide substrates. First, the Ti ions were bombarded under a high vacuum to improve the adhesion strength, second, the TiN films were deposited as interlayers, and finally (Ti,Al)N films were synthesized by 2-3 μm. The interface between TiN and (Ti,Al)N films had no amorphous layer, and they were continuously connected to each other on an atomic scale. Further, Al atoms were not observed in the TiN films even 20 nm away from the TiN-(Ti,Al)N interface. In this paper, the microstructures of (Ti,Al)N films and interfaces between TiN and (Ti,Al)N films were analyzed with high-resolution electron microscopy.

本文言語English
ページ(範囲)41-47
ページ数7
ジャーナルSurface and Coatings Technology
107
1
DOI
出版ステータスPublished - 1998 8 21

ASJC Scopus subject areas

  • 化学 (全般)
  • 凝縮系物理学
  • 表面および界面
  • 表面、皮膜および薄膜
  • 材料化学

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