Microstructures of (Ti,Cr,Al,Si)N films synthesized by cathodic arc method

K. Ichijo, H. Hasegawa, T. Suzuki

研究成果: Article査読

31 被引用数 (Scopus)

抄録

(Ti,Cr,Al,Si)N films were deposited on WC and Si substrate by cathodic arc method with TiCrAlSi alloy cathodes. At lower (Al + Si) contents from 0.56 to 0.60, the crystal structure of (Ti,Cr,Al,Si)N had NaCl type cubic structure. With increasing (Al + Si) contents, the NaCl structure changed to a hexagonal structure. The maximum hardness of (Ti,Cr,Al,Si)N was 31 GPa at 0.56 of (Si + Al) contents. Corresponding with structural changes from NaCl to wurtzite, microhardness decreased down to 26 GPa. TEM photographs indicated that embedding Si atom was effective to decreased grain sizes of 5-10 nm. In this paper, relationships between microstructure and microhardness as a function of Si and Al contents are discussed based on the phase transformation, analyzed by X-ray diffraction method and transmission electron microscopy.

本文言語English
ページ(範囲)5477-5480
ページ数4
ジャーナルSurface and Coatings Technology
201
9-11 SPEC. ISS.
DOI
出版ステータスPublished - 2007 2 26

ASJC Scopus subject areas

  • 化学 (全般)
  • 凝縮系物理学
  • 表面および界面
  • 表面、皮膜および薄膜
  • 材料化学

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