抄録
This study demonstrates new liquid encapsulation method based on adhesive force between liquid and solid. Various liquid encapsulation methods have been proposed. However, these method have limitations. For example, the structure that encapsulates liquid in palyrene membrane are too fragile and not suitable for actuators. Bonding methods can applicable to only two dimensional structures. We developed a liquid encapsulation method with only two process in miniature structure. We utilized magnetorheological (MR) fluid that reacted to an external magnetic field as encapsulated liquid. We investigated the relation between the size and various fabrication factors. We also investigated the relation between the applied magnetic field and the resulting resistive force for application. The results indicated that resistive force increased from 6.2 mN to 9 mN by applying the magnetic field of 400 mT. The structure can be applicable to tactile display that present spatial distribution of stiffness.
本文言語 | English |
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ホスト出版物のタイトル | ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 409-412 |
ページ数 | 4 |
ISBN(印刷版) | 9784904090138 |
DOI | |
出版ステータス | Published - 2015 5月 20 |
イベント | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan 継続期間: 2015 4月 14 → 2015 4月 17 |
Other
Other | 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 |
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国/地域 | Japan |
City | Kyoto |
Period | 15/4/14 → 15/4/17 |
ASJC Scopus subject areas
- 電子工学および電気工学