Modeling of dc magnetron plasma for sputtering: Transport of sputtered copper atoms

Engineering & Materials Science

• Sputtering 100%
• Atoms 80%
• Plasmas 71%
• Ions 71%
• Copper 63%
• Fluxes 38%
• Electrons 31%
• Erosion 31%
• Gases 26%
• Spatial distribution 17%
• Velocity distribution 17%
• Relaxation 14%
• Magnetic fields 13%
• Substrates 11%

Chemical Compounds

• Copper Atom 90%
• Sputtering 84%
• Plasma 48%
• Collision 31%
• Ion 30%
• Gas 24%
• Energy 22%
• Electron Particle 16%
• Monte Carlo Method 16%
• Magnetic Field 14%
• Velocity 13%
• Time 5%

Physics & Astronomy

• sputtering 61%
• copper 55%
• atoms 39%
• erosion 21%
• vapor phases 17%
• ion injection 16%
• ions 15%
• collisions 14%
• light ions 13%
• profiles 12%
• particle energy 11%
• energy 9%
• spatial distribution 9%
• electrons 9%
• velocity distribution 8%
• continuums 8%
• cells 6%
• gases 5%
• magnetic fields 5%