Molecular Dynamics Investigation of Nanometric Cutting of Single-Crystal Silicon Using a Blunt Tool

Seyed Nader Ameli Kalkhoran, Mehrdad Vahdati, Jiwang Yan

研究成果: Article

2 引用 (Scopus)

抜粋

A cutting process is strongly affected by depth of cut (h0) and tool edge radius (re), the relationship of which is described by relative tool sharpness (RTS = h0/re). In nanometric cutting, the depth of cut is far smaller than the tool edge radius, thus the tool is actually a very blunt one with a highly negative effective tool rake angle (~ − 90°). However, most previous studies have assumed the tool is extremely sharp with a nanometric edge radius, and to date there is very little literature on the cutting mechanism for a blunt tool (RTS < 1). In this study, the material deformation/removal behavior and forces under a small RTS from 1 to 0 were investigated via molecular dynamics. The results show that the surface integrity and chip formation are strongly affected by RTS. As RTS is reduced to 0.25 or smaller, rubbing and ploughing occur with no material removal. In such a circumstance, the force angle drops sharply with remarkable subsurface damage formation in the workpiece. These findings are distinctly different from the common belief, and provide new information for the optimization of the silicon wafer manufacturing process.

元の言語English
ページ(範囲)4296-4304
ページ数9
ジャーナルJOM
71
発行部数12
DOI
出版物ステータスPublished - 2019 12 1

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

フィンガープリント Molecular Dynamics Investigation of Nanometric Cutting of Single-Crystal Silicon Using a Blunt Tool' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用