Multichip 1.8-Gb/s high-speed space-division switching module using copper-polyimide multilayer substrate

Naoaki Yamanaka, Shiro Kikuchi, Taichi Kon, Takaaki Ohsaki

研究成果: Conference article査読

29 被引用数 (Scopus)

抄録

A high-speed multichip 32 × 32 space-division switching module for high-definition TV broadcasting and switching systems is described. This module employs a novel Si-bipolar SST (super self-aligned process technology) switching LSI and a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors. The substrate contains matrix-shaped thin-film resistors for terminated transmission and has a spiral via hole structure to increase fabrication reliability. The module has 50-Ω characteristic impedance transmission lines that have a small deviation of less than 2.5%. The multichip module can handle a signal speed of 1.8 Gb/s using 1:1 and 1:n connections. Performance results confirm that this module will be suitable for future B-ISDN (broadband integrated services digital network) communication systems.

本文言語English
ページ(範囲)562-570
ページ数9
ジャーナルProceedings - Electronic Components and Technology Conference
1
出版ステータスPublished - 1990 12月 1
外部発表はい
イベント1990 Proceedings of the 40th Electronic Components and Technology Conference - Las Vegas, NV, USA
継続期間: 1990 5月 201990 5月 23

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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