A high-speed multichip 32 × 32 space-division switching module for high-definition TV broadcasting and switching systems is described. This module employs a novel Si-bipolar SST (super self-aligned process technology) switching LSI and a multilayer substrate with a polyimide dielectric and a fine pattern of copper conductors. The substrate contains matrix-shaped thin-film resistors for terminated transmission and has a spiral via hole structure to increase fabrication reliability. The module has 50-Ω characteristic impedance transmission lines that have a small deviation of less than 2.5%. The multichip module can handle a signal speed of 1.8 Gb/s using 1:1 and 1:n connections. Performance results confirm that this module will be suitable for future B-ISDN (broadband integrated services digital network) communication systems.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 1990 12月 1|
|イベント||1990 Proceedings of the 40th Electronic Components and Technology Conference - Las Vegas, NV, USA|
継続期間: 1990 5月 20 → 1990 5月 23
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