Nanoindentation tests on diamond-machined silicon wafers

Jiwang Yan, Hirokazu Takahashi, Jun'ichi Tamaki, Xiaohui Gai, Hirofumi Harada, John Patten

研究成果: Article査読

53 被引用数 (Scopus)

抄録

Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers. Remarkable differences were found between the two kinds of test results in terms of load-displacement characteristics and indent topologies. The machining-induced amorphous layer was found to have significantly higher microplasticity and lower hardness than pristine silicon. When machining silicon in the ductile mode, we are in essence always machining amorphous silicon left behind by the preceding tool pass; thus, it is the amorphous phase that dominates the machining performance. This work indicated the feasibility of detecting the presence and the mechanical properties of the machining-induced amorphous layers by nanoindentation.

本文言語English
論文番号181913
ページ(範囲)1-3
ページ数3
ジャーナルApplied Physics Letters
86
18
DOI
出版ステータスPublished - 2005 5 2

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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