Nanometric cutting of single crystal silicon for large-diameter aspheric optical element

Jiwang Yan, Jun'ichi Tamaki, Katsuo Syoji, Tsunemoto Kuriyagawa

研究成果: Conference contribution

抄録

A new method for diamond turning aspheric surfaces on hard brittle materials, termed the straight-line enveloping method (SLEM), is proposed. In this method, the aspheric surface is generated using a straight-nosed diamond tool on a three-axis simultaneous control ultra-precision machine tool. This tool geometry enables thinning of the chip in the nanometric range at the same time provides significant width to undeformed chip thickness ratio to ensure plane strain conditions. The cutting experiment of a large single crystal silicon aspheric lens is described. It is demonstrated that the proposed method significantly improves machining efficiency, accuracy and lowers tool wear.

本文言語English
ホスト出版物のタイトルProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
編集者D. Guo, D. Wang, Z. Jia, J. Wang, D. Guo, D. Wang, Z. Jia, J. Wang
ページ25-28
ページ数4
出版ステータスPublished - 2002 12月 1
外部発表はい
イベントProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002) - Dalian, China
継続期間: 2002 7月 102002 7月 12

出版物シリーズ

名前Proceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)

Other

OtherProceedings of the 5th International Conference on Frontiers of Design and Manufacturing (ICFDM'2002)
国/地域China
CityDalian
Period02/7/1002/7/12

ASJC Scopus subject areas

  • 工学(全般)

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