Near-field coupling integration technology

研究成果: Conference contribution

抄録

Invention of IC was driven by "Tyranny of Numbers", a challenge implied by large number of interconnects in a large-scale system. Modern ICs integrate many miles of wiring and billions of contacts. Moore's Law, however, will die, and we cannot rely just on integration on a chip. A revolutionary solution of the connection problem is now needed for further integration. Our proposal, as More-Than-Moore, is to replace mechanical connection using wiring, solder, and connectors by electrical one using near-field coupling. Transmission Line Coupler by electromagnetic coupling for module connection and ThruChip Interface by inductive coupling for chip stacking is presented and discussed in this paper.

元の言語English
ホスト出版物のタイトルInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3)
出版者Electrochemical Society Inc.
ページ83-91
ページ数9
72
エディション3
ISBN(電子版)9781607685395
DOI
出版物ステータスPublished - 2016
イベントInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting - San Diego, United States
継続期間: 2016 5 292016 6 2

Other

OtherInternational Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting
United States
San Diego
期間16/5/2916/6/2

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Electric wiring
Electromagnetic coupling
Patents and inventions
Soldering alloys
Large scale systems
Electric lines

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Kuroda, T. (2016). Near-field coupling integration technology. : International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) (3 版, 巻 72, pp. 83-91). Electrochemical Society Inc.. https://doi.org/10.1149/07203.0083ecst

Near-field coupling integration technology. / Kuroda, Tadahiro.

International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). 巻 72 3. 編 Electrochemical Society Inc., 2016. p. 83-91.

研究成果: Conference contribution

Kuroda, T 2016, Near-field coupling integration technology. : International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). 3 Edn, 巻. 72, Electrochemical Society Inc., pp. 83-91, International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3) - 229th ECS Meeting, San Diego, United States, 16/5/29. https://doi.org/10.1149/07203.0083ecst
Kuroda T. Near-field coupling integration technology. : International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). 3 版 巻 72. Electrochemical Society Inc. 2016. p. 83-91 https://doi.org/10.1149/07203.0083ecst
Kuroda, Tadahiro. / Near-field coupling integration technology. International Symposium on Functional Diversification of Semiconductor Electronics 3 (More-Than-Moore 3). 巻 72 3. 版 Electrochemical Society Inc., 2016. pp. 83-91
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