Non-contact inter-chip data communications technology for system in a package

研究成果: Conference contribution

抜粋

A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive inter-chip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2Gb/s/channel with 45mW from 3.3V in 300μm distance. Cross talk is measured by an embedded voilage detector on the chip, Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on Time Division Multiple Access is also proposed to further reduce the cross talk.

元の言語English
ホスト出版物のタイトルInternational Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
編集者R. Huang, M. Yu, J.J. Liou, T. Hiramito, C. Claeys
ページ1347-1352
ページ数6
2
出版物ステータスPublished - 2004
イベント2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004 - Beijing, China
継続期間: 2004 10 182004 10 21

Other

Other2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT 2004
China
Beijing
期間04/10/1804/10/21

    フィンガープリント

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Kuroda, T. (2004). Non-contact inter-chip data communications technology for system in a package. : R. Huang, M. Yu, J. J. Liou, T. Hiramito, & C. Claeys (版), International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT (巻 2, pp. 1347-1352)