Numerical simulations of high heat dissipation technology in LSI 3-D packaging using carbon nanotube through silicon via (CNT-TSV) and thermal interface material (CNT-TIM)

Teppei Kawanabe, Akio Kawabata, Torno Murakami, Mizuhisa Nihei, Yuji Awano

    研究成果: Conference contribution

    2 被引用数 (Scopus)

    抄録

    We report numerical simulations of heat dissipation properties of nano-carbon through silicon via (TSV), thermal interface material (TIM), and chip package towards a high heat dissipation LSI 3-D packaging. By using vertically aligned multi-walled CNTs (MWNTs) as both TSV and TIM materials and graphite as chip package, a boundary temperature just under a heat source decreased 40.8K in total, comparing to that using conventional materials. This result suggests superior heat dissipation properties of nano-carbon 3-D packaging.

    本文言語English
    ホスト出版物のタイトルProceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013
    DOI
    出版ステータスPublished - 2013 11月 4
    イベント2013 16th IEEE International Interconnect Technology Conference, IITC 2013 - Kyoto, Japan
    継続期間: 2013 6月 132013 6月 15

    出版物シリーズ

    名前Proceedings of the 2013 IEEE International Interconnect Technology Conference, IITC 2013

    Other

    Other2013 16th IEEE International Interconnect Technology Conference, IITC 2013
    国/地域Japan
    CityKyoto
    Period13/6/1313/6/15

    ASJC Scopus subject areas

    • ハードウェアとアーキテクチャ
    • 制御およびシステム工学

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