Practical realization of enfold connecting system of artificial blood vessel for simplifying maintenance surgery evaluation of thrombus formation and blood coagulation capasity

A. Watanabe, T. Ota, Y. Kanno, Norihisa Miki

研究成果: Conference contribution

抄録

Evaluations for the enfold connecting system of system is developed to reduce and simplify the maintenance surgery of the artificial organ.The connector is designed not to contact the blood directly and the artificial blood vessel enfolds metal pipe in connector. Thanks to this design, the biocompatibility of the connector is comparable with an artificial vessel. We confirmed the blood coagulate protein which form a thrombus at the joint point of the connector with SEM. And we also measured a potential of blood coagulation by activated partial thromboplastin time (APTT). We didn't find the remarkable increase of blood coagulation on the connecting point for 72 hours. And APTT decreased a little in the experiment of a blood circulation system with the connector but we can't conclude that the connector causes a blood coagulation from results for 120 minutes. Additionally, we measured a potential of blood coagulation by APTT about the micro dialysis device which is developed in our group. We conducted the micro dialysis device experiments as with the same method of the connector experiments of APTT. We did not observe the remarkable disease of APTT for 120 minutes about the micro dialysis device as well. However, we found that the hemolysis was possible to be occurred in the micro dialysis device.

本文言語English
ホスト出版物のタイトル2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ141-144
ページ数4
ISBN(電子版)9784990218850
DOI
出版ステータスPublished - 2018 6 6
イベント2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
継続期間: 2018 4 172018 4 21

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
国/地域Japan
CityKuwana, Mie
Period18/4/1718/4/21

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • ポリマーおよびプラスチック

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