Prediction of organic low-k material etching in two frequency capacitively coupled plasma

Low-k materials are among the promising interlayer dielectric in terms of reducing the circuit transmission time. H₂/N₂ plasma is currently considered to be appropriate for organic low-k material etching, with both N and H radicals playing important roles on the feature profile of the etching. We have numerically estimated the influence of active species on the feature profile evolution of an organic low-k by changing the H ₂/N₂ mixture ratio by using a hybrid numerical model (extended-VicAddress), through the predictive image of the two frequency capacitively coupled plasma in H₂/N₂. We also discuss typical external plasma conditions producing a taper and bowing profiles. The predicted etch rate and feature profile reasonably reproduce the previous experimental results.