Present status and future prospects of nano-carbon interconnect technologies for LSIs

Yuji Awano

    研究成果: Conference contribution

    抄録

    We report on the present status and future prospect of nano-carbon interconnect technologies, consisting of carbon nanotube (CNT) vertical interconnects (vias) and graphene horizontal interconnects, mainly in terms of material growth and fabrication process technologies to meet the requirement of process compatibility with a conventional Si LSI. Their superior electrical properties for replacing Cu interconnects are demonstrated.

    本文言語English
    ホスト出版物のタイトルTechnical Digest - International Electron Devices Meeting, IEDM
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ15.5.1-15.5.4
    2016-February
    ISBN(印刷版)9781467398930
    DOI
    出版ステータスPublished - 2016 2月 16
    イベント61st IEEE International Electron Devices Meeting, IEDM 2015 - Washington, United States
    継続期間: 2015 12月 72015 12月 9

    Other

    Other61st IEEE International Electron Devices Meeting, IEDM 2015
    国/地域United States
    CityWashington
    Period15/12/715/12/9

    ASJC Scopus subject areas

    • 電子工学および電気工学
    • 凝縮系物理学
    • 電子材料、光学材料、および磁性材料
    • 材料化学

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