Real-time enhancement of RGB-D point clouds using piecewise plane fitting

Kazuki Matsumoto, Francois De Sorbier, Hideo Saito

研究成果: Conference contribution

4 引用 (Scopus)

抜粋

In this paper, we propose an efficient framework for reducing noise and holes in depth map captured with an RGB-D camera. This is performed by applying plane fitting to the groups of points assimilable to planar structures and filtering the curved surface points. We present a new method for finding global planar structures in a 3D scene by combining superpixel segmentation and graph component labeling. The superpixel segmentation is based on not only color information but also depth and normal maps. The labeling process is carried out by considering each normal in given superpixel's clusters. We evaluate the reliability of each plane structure and apply the plane fitting only to true planar surfaces. As a result, our system can reduce the noise of the depth map especially on planar area while preserving curved surfaces. The process is done in real-time thanks to GPGPU acceleration via CUDA architecture.

元の言語English
ホスト出版物のタイトルEUVIP 2014 - 5th European Workshop on Visual Information Processing
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781479945726
DOI
出版物ステータスPublished - 2015 1 22
イベント5th European Workshop on Visual Information Processing, EUVIP 2014 - Paris, France
継続期間: 2014 12 102014 12 12

出版物シリーズ

名前EUVIP 2014 - 5th European Workshop on Visual Information Processing

Other

Other5th European Workshop on Visual Information Processing, EUVIP 2014
France
Paris
期間14/12/1014/12/12

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Information Systems
  • Signal Processing

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  • これを引用

    Matsumoto, K., De Sorbier, F., & Saito, H. (2015). Real-time enhancement of RGB-D point clouds using piecewise plane fitting. : EUVIP 2014 - 5th European Workshop on Visual Information Processing [7018365] (EUVIP 2014 - 5th European Workshop on Visual Information Processing). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EUVIP.2014.7018365