We have developed a high-throughput, compact network switch (the RHiNET-2/SW) for a distributed parallel computing system. Eight pairs of 800-Mbit/s×12-channel optical interconnection modules and a CMOS ASIC switch are integrated on a compact circuit board. To realize high-throughput (64 Gbit/s) and low-latency network, the SW-LSI has a customized high-speed LVDS I/O interface, and a high-speed internal SRAM memory in a 784-pin BGA one-chip package. We have also developed device implementation technologies to overcome the electrical problems (loss and crosstalk) caused by such high integration. The RHiNET-2/SW system enables high-performance parallel processing in a distributed computing environment.
ASJC Scopus subject areas
- コンピュータ ネットワークおよび通信