Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov, Feier Cao, Benjamin Tag, Gemma Liu, Cedric Caremel, Kai Steven Kunze

研究成果: Conference contribution

4 引用 (Scopus)

抄録

This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

元の言語English
ホスト出版物のタイトルISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
出版者Association for Computing Machinery
ページ112-119
ページ数8
ISBN(電子版)9781450359672
DOI
出版物ステータスPublished - 2018 10 8
イベント22nd International Symposium on Wearable Computers, ISWC 2018 - Singapore, Singapore
継続期間: 2018 10 82018 10 12

Other

Other22nd International Symposium on Wearable Computers, ISWC 2018
Singapore
Singapore
期間18/10/818/10/12

Fingerprint

Shape memory effect
Actuators
Mechanical actuators
Wire
Skin
Neural networks

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Computer Networks and Communications

これを引用

Chernyshov, G., Cao, F., Tag, B., Liu, G., Caremel, C., & Kunze, K. S. (2018). Shape memory alloy wire actuators for soft, wearable haptic devices. : ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers (pp. 112-119). Association for Computing Machinery. https://doi.org/10.1145/3267242.3267257

Shape memory alloy wire actuators for soft, wearable haptic devices. / Chernyshov, George; Cao, Feier; Tag, Benjamin; Liu, Gemma; Caremel, Cedric; Kunze, Kai Steven.

ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, 2018. p. 112-119.

研究成果: Conference contribution

Chernyshov, G, Cao, F, Tag, B, Liu, G, Caremel, C & Kunze, KS 2018, Shape memory alloy wire actuators for soft, wearable haptic devices. : ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, pp. 112-119, 22nd International Symposium on Wearable Computers, ISWC 2018, Singapore, Singapore, 18/10/8. https://doi.org/10.1145/3267242.3267257
Chernyshov G, Cao F, Tag B, Liu G, Caremel C, Kunze KS. Shape memory alloy wire actuators for soft, wearable haptic devices. : ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery. 2018. p. 112-119 https://doi.org/10.1145/3267242.3267257
Chernyshov, George ; Cao, Feier ; Tag, Benjamin ; Liu, Gemma ; Caremel, Cedric ; Kunze, Kai Steven. / Shape memory alloy wire actuators for soft, wearable haptic devices. ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, 2018. pp. 112-119
@inproceedings{7de1fa0ff10c41b0a4268afdeb6074ba,
title = "Shape memory alloy wire actuators for soft, wearable haptic devices",
abstract = "This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.",
keywords = "Haptics, Shape Memory Alloys., Soft Robotics, Wearable Devices",
author = "George Chernyshov and Feier Cao and Benjamin Tag and Gemma Liu and Cedric Caremel and Kunze, {Kai Steven}",
year = "2018",
month = "10",
day = "8",
doi = "10.1145/3267242.3267257",
language = "English",
pages = "112--119",
booktitle = "ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers",
publisher = "Association for Computing Machinery",

}

TY - GEN

T1 - Shape memory alloy wire actuators for soft, wearable haptic devices

AU - Chernyshov, George

AU - Cao, Feier

AU - Tag, Benjamin

AU - Liu, Gemma

AU - Caremel, Cedric

AU - Kunze, Kai Steven

PY - 2018/10/8

Y1 - 2018/10/8

N2 - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

AB - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

KW - Haptics

KW - Shape Memory Alloys.

KW - Soft Robotics

KW - Wearable Devices

UR - http://www.scopus.com/inward/record.url?scp=85056845945&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85056845945&partnerID=8YFLogxK

U2 - 10.1145/3267242.3267257

DO - 10.1145/3267242.3267257

M3 - Conference contribution

AN - SCOPUS:85056845945

SP - 112

EP - 119

BT - ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers

PB - Association for Computing Machinery

ER -