Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov, Feier Cao, Benjamin Tag, Gemma Liu, Cedric Caremel, Kai Kunze

研究成果: Conference contribution

16 被引用数 (Scopus)

抄録

This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

本文言語English
ホスト出版物のタイトルISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
出版社Association for Computing Machinery
ページ112-119
ページ数8
ISBN(電子版)9781450359672
DOI
出版ステータスPublished - 2018 10 8
イベント22nd International Symposium on Wearable Computers, ISWC 2018 - Singapore, Singapore
継続期間: 2018 10 82018 10 12

出版物シリーズ

名前Proceedings - International Symposium on Wearable Computers, ISWC
ISSN(印刷版)1550-4816

Other

Other22nd International Symposium on Wearable Computers, ISWC 2018
国/地域Singapore
CitySingapore
Period18/10/818/10/12

ASJC Scopus subject areas

  • ソフトウェア
  • ハードウェアとアーキテクチャ
  • コンピュータ ネットワークおよび通信

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