Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov; Feier Cao; Benjamin Tag; Gemma Liu; Cedric Caremel; Kai Steven Kunze

doi:10.1145/3267242.3267257

Shape memory alloy wire actuators for soft, wearable haptic devices

George Chernyshov, Feier Cao, Benjamin Tag, Gemma Liu, Cedric Caremel, Kai Steven Kunze

メディアデザイン研究科

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

本文言語	English
ホスト出版物のタイトル	ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers
出版社	Association for Computing Machinery
ページ	112-119
ページ数	8
ISBN（電子版）	9781450359672
DOI	https://doi.org/10.1145/3267242.3267257
出版ステータス	Published - 2018 10 8
イベント	22nd International Symposium on Wearable Computers, ISWC 2018 - Singapore, Singapore 継続期間: 2018 10 8 → 2018 10 12

Other

Other	22nd International Symposium on Wearable Computers, ISWC 2018
Country	Singapore
City	Singapore
Period	18/10/8 → 18/10/12

ASJC Scopus subject areas

Software
Hardware and Architecture
Computer Networks and Communications

文献へのアクセス

10.1145/3267242.3267257

フィンガープリント「Shape memory alloy wire actuators for soft, wearable haptic devices」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Chernyshov, G, Cao, F, Tag, B, Liu, G, Caremel, C & Kunze, KS 2018, Shape memory alloy wire actuators for soft, wearable haptic devices. in ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers. Association for Computing Machinery, pp. 112-119, 22nd International Symposium on Wearable Computers, ISWC 2018, Singapore, Singapore, 18/10/8. https://doi.org/10.1145/3267242.3267257

@inproceedings{7de1fa0ff10c41b0a4268afdeb6074ba,

title = "Shape memory alloy wire actuators for soft, wearable haptic devices",

abstract = "This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.",

keywords = "Haptics, Shape Memory Alloys., Soft Robotics, Wearable Devices",

author = "George Chernyshov and Feier Cao and Benjamin Tag and Gemma Liu and Cedric Caremel and Kunze, {Kai Steven}",

year = "2018",

month = oct,

day = "8",

doi = "10.1145/3267242.3267257",

language = "English",

pages = "112--119",

booktitle = "ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers",

publisher = "Association for Computing Machinery",

note = "22nd International Symposium on Wearable Computers, ISWC 2018 ; Conference date: 08-10-2018 Through 12-10-2018",

}

TY - GEN

T1 - Shape memory alloy wire actuators for soft, wearable haptic devices

AU - Chernyshov, George

AU - Cao, Feier

AU - Tag, Benjamin

AU - Liu, Gemma

AU - Caremel, Cedric

AU - Kunze, Kai Steven

PY - 2018/10/8

Y1 - 2018/10/8

N2 - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

AB - This paper presents a new approach to implement wearable haptic devices using Shape Memory Alloy (SMA) wires. The proposed concept allows building silent, soft, flexible and lightweight wearable devices, capable of producing the sense of pressure on the skin without any bulky mechanical actuators. We explore possible design considerations and applications for such devices, present user studies proving the feasibility of delivering meaningful information and use nonlinear au-toregressive neural networks to compensate for SMA inherent drawbacks, such as delayed onset, enabling us to characterize and predict the physical behavior of the device.

KW - Haptics

KW - Shape Memory Alloys.

KW - Soft Robotics

KW - Wearable Devices

UR - http://www.scopus.com/inward/record.url?scp=85056845945&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85056845945&partnerID=8YFLogxK

U2 - 10.1145/3267242.3267257

DO - 10.1145/3267242.3267257

M3 - Conference contribution

AN - SCOPUS:85056845945

SP - 112

EP - 119

BT - ISWC 2018 - Proceedings of the 2018 ACM International Symposium on Wearable Computers

PB - Association for Computing Machinery

T2 - 22nd International Symposium on Wearable Computers, ISWC 2018

Y2 - 8 October 2018 through 12 October 2018

ER -