Sintered diamond as a hybrid EDM and grinding tool for the micromachining of single-crystal SiC

Jiwang Yan, Tsong Han Tan

研究成果: Article

12 引用 (Scopus)

抄録

Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (R<inf>a</inf> = 1.85 nm) was obtained.

元の言語English
ページ(範囲)221-224
ページ数4
ジャーナルCIRP Annals - Manufacturing Technology
64
発行部数1
DOI
出版物ステータスPublished - 2015

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Electric discharge machining
Grinding wheels
Micromachining
Diamonds
Single crystals
Surface topography
Hardness
Wear of materials

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

これを引用

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AB - Sintered diamond was used as a hybrid tool for micro-scale electrical discharge machining (EDM) and grinding of single-crystal SiC to achieve both high efficiency and surface integrity. Material removal behavior, surface topography, and subsurface damage for both process steps were investigated under various conditions. The results showed that SiC decomposed into Si and C during EDM, creating a very thick recast layer which had remarkably lower hardness than the bulk. Owing to the electrical dressing effect in EDM, diamond grains protrude out of tool surface and grind the recast layer in a ductile manner with low tool wear. An extremely smooth surface (Ra = 1.85 nm) was obtained.

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