Stress singularities at the interface crack and the corner of edge-bonded dissimilar materials

Toshiro Miyoshi, Masaki Shiratori, Hiroshi Okuda, Naoki Takano

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.

本文言語English
ホスト出版物のタイトルAmerican Society of Mechanical Engineers, EEP
出版社Publ by ASME
ページ551-557
ページ数7
ISBN(印刷版)0791807665
出版ステータスPublished - 1992 12 1
外部発表はい
イベントProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
継続期間: 1992 4 91992 4 12

出版物シリーズ

名前American Society of Mechanical Engineers, EEP
1

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 機械工学

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