From a structural point of view, the electronic devices and/or components can be classified as the multi-layered structures composed of dissimilar materials. Therefore, the stress singularities caused by the mismatch of the elastic constants and the thermal expansion coefficients has to be taken into consideration when carrying out the finite element stress analysis. In this paper, the stress singularities encountered at the corner of the bonded edge and/or the interface crack tip in dissimilar materials are theoretically described. Furthermore, it is demonstrated that the finite element method can properly explain the theoretical stress singularities i.e. the order of the singularity and the stress distributions. The intensity of the singular stress field, which is measured by the stress intensity factor, is also analyzed.