This paper presents a low-power large-capacity ATM switching system design and modules (LSI and MCM). The design uses MCM technology with a copper-polyimide substrate, 150-μm pitch outer lead TAB and 98-highway flexible printed circuit cables for high-density packaging and high-speed operation. Using these technologies, a 160 Gbit/s ATM switching system with a power dissipation of about 1.3 kW can be achieved for future Broadband ISDN systems. This power is 65% of that of the reported system which uses ECL I/Os, and can be cooled by forced air with conventional fin-structures.
|出版ステータス||Published - 1995 12月 1|
|イベント||Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology - Omiya, Jpn|
継続期間: 1995 12月 4 → 1995 12月 6
|Other||Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology|
|Period||95/12/4 → 95/12/6|
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