Surface relief and porous structure patterning of polyimide

Fumiaki Kodera, Yasushi Matsuzawa, Kunihiko Okano, Etsuko Tomiyama, Takashi Yamashita

研究成果: Article査読

3 被引用数 (Scopus)

抄録

Polyimides have excellent properties such as thermo stability, mechanical strength, and chemical stability, which are widely used as the materials for microelectronics and aerospace. We discover the new process of porous structure patterning and surface relief patterning. Porous structure patterning of polyimide is based on poly (amide acid) and photo acid generator (PAG, NAI100). Photo irradiation of the PAA in the presence of PAG induce surface relief grating after thermal imidization. The tone can be controlled using PAG or PBG. The mechanism of the pattern formation is based on the change in imidization temperature by the PAG or PBG.

本文言語English
ページ(範囲)235-240
ページ数6
ジャーナルJournal of Photopolymer Science and Technology
23
2
DOI
出版ステータスPublished - 2010

ASJC Scopus subject areas

  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

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