System integration in a package for cloud and edge

研究成果: Conference contribution

抜粋

Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

元の言語English
ホスト出版物のタイトル2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
出版者Institute of Electrical and Electronics Engineers Inc.
ページ42-43
ページ数2
ISBN(電子版)9781509046591
DOI
出版物ステータスPublished - 2017 6 13
イベント2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
継続期間: 2017 2 282017 3 2

Other

Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Japan
Toyama
期間17/2/2817/3/2

    フィンガープリント

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Kuroda, T. (2017). System integration in a package for cloud and edge. : 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (pp. 42-43). [7947513] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.7947513