System integration in a package for cloud and edge

Tadahiro Kuroda

    研究成果: Conference contribution

    抄録

    Integrated Circuit (IC) was invented in 1958 in the process of challenges to 'Tyranny of Numbers'. We face the same challenge again with the end of Moore's Law and rise of IoT. A near-field coupling integration technology (Fig.1) is proposed as a new solution in very large system to replace mechanical connections by electrical ones. This paper presents two technologies. ThruChip Interface (TCI) replaces TSVs and enables 3D integrations to improve power efficiency in cloud computing. Transmission Line Couper (TLC) replaces mechanical connectors and enables LEGO-type module assembly for edge sensors.

    本文言語English
    ホスト出版物のタイトル2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ42-43
    ページ数2
    ISBN(電子版)9781509046591
    DOI
    出版ステータスPublished - 2017 6 13
    イベント2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
    継続期間: 2017 2 282017 3 2

    出版物シリーズ

    名前2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

    Other

    Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
    CountryJapan
    CityToyama
    Period17/2/2817/3/2

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

    フィンガープリント 「System integration in a package for cloud and edge」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル