System level thermal design-process modeling for functional/structure design using SysML and MDM

Kenichi Seki, Yoshio Muraoka, Hidekazu Nishimura

研究成果: Conference contribution

抄録

The conventional thermal design process for consumer electronics focusing exclusively on hardware is becoming insufficient for limiting thermal risk in the market. This study uses system modeling language (SysML) and a multipledomain matrix (MDM) to examine the thermal design process at the system level, which comprises both hardware and software. The entire thermal design process is visualized using an MDM comprising design structure matrices for the function, performance, and structure of a product and the correlations between them. It is demonstrated through the trade-off study of image processor selection and a machine design that our proposed thermal design process can lead better product specifications in terms of thermal performance and parts cost.

本文言語English
ホスト出版物のタイトルModeling and Managing Complex Systems - Proceedings of the 17th International DSM Conference
出版社Carl Hanser Verlag
ページ149-159
ページ数11
ISBN(印刷版)9783446445734
出版ステータスPublished - 2015
イベント17th International Dependency and Structure Modeling Conference, DSM 2015 - Fort Worth, United States
継続期間: 2015 11 42015 11 6

Other

Other17th International Dependency and Structure Modeling Conference, DSM 2015
CountryUnited States
CityFort Worth
Period15/11/415/11/6

ASJC Scopus subject areas

  • Artificial Intelligence
  • Management of Technology and Innovation
  • Software
  • Computational Mathematics

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