Temperature-based request distribution for effective CRAC and equipment life-cycle extension

Yusuke Nakajo, Hiroaki Nishi

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

With the growth of Internet-based services, data centers must deal with increasing data traffic. Load-balancing technologies can help data centers process data effectively and stably; however, the current load-balancing methods do not take into account the heat generated by servers. Excessive heat can increase the failure rate of IT devices and the energy consumption of air conditioning systems, both of which lead to higher data center maintenance costs. This paper aims to simultaneously increase the coefficient of performance (COP) of the data center's air-conditioning equipment and decrease the semiconductor-based equipment failure rate. To do so-and, consequently, reduce the operation and maintenance costs-we propose a novel request distribution system based on servertemperature and evaluate the proposed system by creating a thermal model of a data center. As a result, it is suggested that using the proposed load-balancing method the semiconductor failure rate can be reduced by 32 % when compared with the common round-robin distribution method, and by 19 % when compared with a load-balancing method based on CPU utilization. Moreover, the COP of the air-conditioning equipment obtained with the proposed method is recognized to be higher than those obtained with either the round-robin or the CPUutilization- based methods.

本文言語English
ホスト出版物のタイトルASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
出版社American Society of Mechanical Engineers
ISBN(電子版)9780791858097
DOI
出版ステータスPublished - 2017 1 1
イベントASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, United States
継続期間: 2017 8 292017 9 1

Other

OtherASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
国/地域United States
CitySan Francisco
Period17/8/2917/9/1

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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