Thermal analysis of laser irradiation of fused silica

Peng Yao, Yadong Gong, Suoxian Yuan, Tianfeng Zhou, Jiwang Yan, Tsunemoto Kuriyagawa

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.

元の言語English
ホスト出版物のタイトルAdvanced Manufacturing Technology
ページ1960-1964
ページ数5
DOI
出版物ステータスPublished - 2011
外部発表Yes
イベント2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011 - Guangzhou, China
継続期間: 2011 9 162011 9 18

出版物シリーズ

名前Advanced Materials Research
314-316
ISSN(印刷物)1022-6680

Other

Other2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011
China
Guangzhou
期間11/9/1611/9/18

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Yao, P., Gong, Y., Yuan, S., Zhou, T., Yan, J., & Kuriyagawa, T. (2011). Thermal analysis of laser irradiation of fused silica. : Advanced Manufacturing Technology (pp. 1960-1964). (Advanced Materials Research; 巻数 314-316). https://doi.org/10.4028/www.scientific.net/AMR.314-316.1960