TY - GEN
T1 - Thermal analysis of laser irradiation of fused silica
AU - Yao, Peng
AU - Gong, Yadong
AU - Yuan, Suoxian
AU - Zhou, Tianfeng
AU - Yan, Jiwang
AU - Kuriyagawa, Tsunemoto
N1 - Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2011
Y1 - 2011
N2 - To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.
AB - To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.
KW - CO laser irradiation
KW - Fused silica
KW - Repair
KW - Single pass scan
KW - Surface and subsurface micro cracks
KW - Thermal analysis
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U2 - 10.4028/www.scientific.net/AMR.314-316.1960
DO - 10.4028/www.scientific.net/AMR.314-316.1960
M3 - Conference contribution
AN - SCOPUS:80053002358
SN - 9783037852156
T3 - Advanced Materials Research
SP - 1960
EP - 1964
BT - Advanced Manufacturing Technology
T2 - 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011
Y2 - 16 September 2011 through 18 September 2011
ER -