Thermal emission rates and capture cross sections of majority carriers at vanadium centers in silicon

Eiji Ohta, Makoto Sakata

研究成果: Article査読

14 被引用数 (Scopus)

抄録

The thermal emission rates and capture cross sections of majority carriers on the vandium associated centers in the depletion region of reverse biased silicon p-n junctions have been measured by the dark capacitance transient method. The three vanduim associated levels observed, two donor levels and a deep acceptor level, belong to the same vandium center. Least square fits of the emission data give the following emission rates; enlt = 1.047 × 106T2 exp [−0.179±0.004 eV/kT], en0t = 3.55 × 107T2 exp [−0.426±0.004 eV/kT] and ep-2t = 1.514 × 106T2 exp [−0.450±0.003 eV/kT]. The activation energy of the hole emission rate at the lower donor level is about 0.1 eV larger than the equilibrium thermal activation energy. The capture cross sections are σn0 = 3 × 10−17cm2 and σp0 = 8 × 10−16cm2 for the electron capture process at the deep acceptor level and the hole capture process at the upper donor level, respectively. The hole capture cross section on the lower donor level (σp-1) depends significantly on temperature. The large temperature dependence of the hole capture cross section can be expected due to the nonradiative multiphonon emission process.

本文言語English
ページ(範囲)759-764
ページ数6
ジャーナルSolid-State Electronics
23
7
DOI
出版ステータスPublished - 1980
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

フィンガープリント

「Thermal emission rates and capture cross sections of majority carriers at vanadium centers in silicon」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル