TY - JOUR
T1 - Thermal management of software changes in product lifecycle of consumer electronics
AU - Muraoka, Yoshio
AU - Nishimura, Hidekazu
AU - Seki, Kenichi
N1 - Publisher Copyright:
© IFIP International Federation for Information Processing 2014.
PY - 2014
Y1 - 2014
N2 - Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.
AB - Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.
KW - Collab-orative design
KW - Electronic products
KW - Embedded system
KW - Low-temperature burn injury
KW - Product lifecycle management
KW - Simulation
KW - Software change
KW - SysML
KW - System level
KW - Thermal design
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U2 - 10.1007/978-3-662-45937-9_24
DO - 10.1007/978-3-662-45937-9_24
M3 - Article
AN - SCOPUS:84919331994
VL - 442
SP - 237
EP - 246
JO - IFIP Advances in Information and Communication Technology
JF - IFIP Advances in Information and Communication Technology
SN - 1868-4238
ER -