Thermal management of software changes in product lifecycle of consumer electronics

Yoshio Muraoka, Hidekazu Nishimura, Kenichi Seki

研究成果: Article査読

1 被引用数 (Scopus)

抄録

Because the power consumption of consumer electronic products varies according to processor execution, which depends on software, thermal risk may be increased by software changes, including software updates or the installation of new applications, even after hardware development has been completed. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structure. Then, we investigate a case study of thermal management in both the development and maintenance phases of the product lifecycle. Reusing the simulation model, the thermal risk of software changes that may cause an enormous number of variations can be efficiently evaluated.

本文言語English
ページ(範囲)237-246
ページ数10
ジャーナルIFIP Advances in Information and Communication Technology
442
DOI
出版ステータスPublished - 2014

ASJC Scopus subject areas

  • 情報システム
  • コンピュータ ネットワークおよび通信
  • 情報システムおよび情報管理

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