Thruchip interface for heterogeneous chip stacking

Tadahiro Kuroda

研究成果: Conference contribution

抄録

This paper presents a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is much less expensive than TSV (Through Silicon Via) but bears comparison in performance. Delay time and energy dissipation will scale down by scaling device size and chip thickness. As the inductive coupling enables interface among chips under different supply voltages, TCI is suitable for heterogeneous integration. A 90nm 8- core processor under 1.0V power supply and two 65nm SRAM's under 1.2V power supply are stacked and AC-coupled by TCI at 19.2Gb/s. Power dissipation and area efficiency of the link is 1pJ/b and 0.15mm2/Gbps respectively, which is 1/30 and 1/3 in comparison with the conventional DDR2 interface.

本文言語English
ホスト出版物のタイトルInternational Symposium on Functional Diversification of Semiconductor Electronics
出版社Electrochemical Society Inc.
ページ63-68
ページ数6
14
ISBN(印刷版)9781623320133
DOI
出版ステータスPublished - 2013
外部発表はい
イベントSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012 - Honolulu, HI, United States
継続期間: 2012 10月 72012 10月 12

出版物シリーズ

名前ECS Transactions
番号14
50
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Other

OtherSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012
国/地域United States
CityHonolulu, HI
Period12/10/712/10/12

ASJC Scopus subject areas

  • 工学(全般)

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