Thruchip interface for heterogeneous chip stacking

Tadahiro Kuroda

    研究成果: Conference contribution

    抄録

    This paper presents a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI). TCI is a digital CMOS circuit solution in a standard CMOS technology. It is much less expensive than TSV (Through Silicon Via) but bears comparison in performance. Delay time and energy dissipation will scale down by scaling device size and chip thickness. As the inductive coupling enables interface among chips under different supply voltages, TCI is suitable for heterogeneous integration. A 90nm 8- core processor under 1.0V power supply and two 65nm SRAM's under 1.2V power supply are stacked and AC-coupled by TCI at 19.2Gb/s. Power dissipation and area efficiency of the link is 1pJ/b and 0.15mm2/Gbps respectively, which is 1/30 and 1/3 in comparison with the conventional DDR2 interface.

    本文言語English
    ホスト出版物のタイトルInternational Symposium on Functional Diversification of Semiconductor Electronics
    ページ63-68
    ページ数6
    14
    DOI
    出版ステータスPublished - 2012 12 1
    イベントSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012 - Honolulu, HI, United States
    継続期間: 2012 10 72012 10 12

    出版物シリーズ

    名前ECS Transactions
    番号14
    50
    ISSN(印刷版)1938-5862
    ISSN(電子版)1938-6737

    Other

    OtherSymposium on More than Moore - 222nd ECS Meeting/PRiME 2012
    CountryUnited States
    CityHonolulu, HI
    Period12/10/712/10/12

    ASJC Scopus subject areas

    • Engineering(all)

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