ThruChip interface (TCI) for 3D networks on chip

研究成果: Conference contribution

6 引用 (Scopus)

抜粋

This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.

元の言語English
ホスト出版物のタイトル2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
ページ238-241
ページ数4
DOI
出版物ステータスPublished - 2011 12 22
イベント2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong
継続期間: 2011 10 32011 10 5

出版物シリーズ

名前2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011

Other

Other2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Hong Kong
Kowloon
期間11/10/311/10/5

    フィンガープリント

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Kuroda, T. (2011). ThruChip interface (TCI) for 3D networks on chip. : 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 (pp. 238-241). [6081644] (2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011). https://doi.org/10.1109/VLSISoC.2011.6081644