ThruChip interface (TCI) for 3D networks on chip

Tadahiro Kuroda

    研究成果: Conference contribution

    10 被引用数 (Scopus)

    抄録

    This paper presents a wireless interconnection for 3D Networks on Chip, namely ThruChip Interface (TCI). TCI employs near field inductive coupling that is suitable for high-density parallel channel arrangement with small cross talk. It is less expensive than TSV by over 20¢/chip, since it is implemented by digital circuits in a standard CMOS. It bears comparison with TSV in terms of data rate (10Gb/s/ch), reliability (BER<10-14), and energy dissipation (0.1pJ/b). ESD protection devices can be eliminated to lower delay, power, and area. It provides with an AC coupling link to make interface design easy under multiple/variable VDD's. The cost/performance will further be improved exponentially by thinning chip thickness. This talk will cover basics, applications, and future perspectives of the TCI.

    本文言語English
    ホスト出版物のタイトル2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
    ページ238-241
    ページ数4
    DOI
    出版ステータスPublished - 2011
    イベント2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong
    継続期間: 2011 10月 32011 10月 5

    出版物シリーズ

    名前2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011

    Other

    Other2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
    国/地域Hong Kong
    CityKowloon
    Period11/10/311/10/5

    ASJC Scopus subject areas

    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

    フィンガープリント

    「ThruChip interface (TCI) for 3D networks on chip」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル