Towards understanding the mechanism of vibration-assisted cutting of monocrystalline silicon by cyclic nanoindentation

Weihai Huang, Jiwang Yan

研究成果: Article査読

抄録

Ultrasonic vibration cutting (UVC) is a promising technology that can promote the processing of hard-brittle materials in ductile mode. The feature of intermittent cutting in UVC is considered to promote the ductile responses of brittle materials. However, the effect of cyclic loading/impact on microscopic deformation behavior of the workpiece material in UVC is not clearly understood. This study used cyclic nanoindentation to reveal the UVC mechanism in monocrystalline silicon (Si). The surface morphology and subsurface microstructure of the residual indents were characterized and compared with those of the UVC-machined grooves. This work attempted to correlate the tool-workpiece contacts for cyclic nanoindentation and vibration cutting. Cyclic nanoindentation results show that cyclic loading promotes the extent of silicon amorphization and decreases the threshold for transitioning the β–Sn phase to the bc8 and r8 phases. As the number of indentation cycles increases, the subsurface microstructure changes from the amorphous phase to the bc8 and r8 phases. In UVC, both the critical cutting depth for brittle-to-ductile transition and the degree of amorphization in cutting chips increase in comparison to conventional cutting, which matches the trend of cyclic nanoindentation results. The findings inform the chip formation and subsurface deformation mechanisms of brittle materials during UVC.

本文言語English
論文番号117797
ジャーナルJournal of Materials Processing Technology
311
DOI
出版ステータスPublished - 2023 1月

ASJC Scopus subject areas

  • セラミックおよび複合材料
  • コンピュータ サイエンスの応用
  • 金属および合金
  • 産業および生産工学

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