Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers

Jiwang Yan, Hirokazu Takahashi, Jun'ichi Tamaki, Xiaohui Gai, Tsunemoto Kuriyagawa

研究成果: Article査読

37 被引用数 (Scopus)

抄録

Nanoindentation tests were performed on a ductile-machined silicon wafer with a Berkovich diamond indenter, and the resulting indents were examined with a transmission electron microscope. It was found that the machining-induced subsurface amorphous layer undergoes significant plastic flow, and the microstructure of the indent depends on the indentation load. At a small load (∼20 mN), most of the indented region remains to be amorphous with minor crystalline nuclei; while under a large load (∼50 mN), the amorphous phase undergoes intensive recrystallization. The understanding and utilization of this phenomenon might be useful for improving the microscopic surface properties of silicon parts produced by a ductile machining process.

本文言語English
論文番号211901
ページ(範囲)1-3
ページ数3
ジャーナルApplied Physics Letters
87
21
DOI
出版ステータスPublished - 2005
外部発表はい

ASJC Scopus subject areas

  • 物理学および天文学(その他)

フィンガープリント

「Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル