Ultraprecision cutting of photoresist/gold composite microstructures

研究成果: Article査読

4 被引用数 (Scopus)

抄録

Ultraprecision cutting tests were performed on a photoresist/gold bump composite and cutting characteristics were investigated by examining the surface topography, chip formation, cutting force, and temperature. The cutting mechanisms depended significantly on the cutting speed, undeformed chip thickness, and tool geometry. At a high cutting speed, photoresist softening occurred, leading to chip adhesion on tool faces and burr formation on gold bumps. Two kinds of microfractures were identified in the photoresist cutting, and critical cutting conditions for each were obtained. The findings in this study provide process criteria for ultraprecise planarization of LSI substrates for three-dimensional chip implementing technology.

本文言語English
ページ(範囲)133-136
ページ数4
ジャーナルCIRP Annals - Manufacturing Technology
60
1
DOI
出版ステータスPublished - 2011
外部発表はい

ASJC Scopus subject areas

  • 機械工学
  • 産業および生産工学

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